Flow&Parameters

Flow&Parameters

6 SMT lines,Fuji XPF, NXT3, Fully automatic solder paste printing machine, Ten temperature zone reflow oven, AOI, SPI and other equipment, SMD production capacity 6 million Solder joints / day, Good at high precision, high complexity PCB.

SMT Production capacity6 million Solder joints/day
SMT LINE6 line
drop materials rate1Resistance and capacitance0.3%
2.IC, no drops
Board typesPOP/FR4/FPC/Rigid-flex board/Metal substrate
SMT component specificationsThe smallest package03015 Chip/0.35 Pitch BGA
Minimum device accuracy±0.04mm
IC chip mounting accuracy±0.03mm
PCB mounting size specificationsPCB size50*50mm - 686*508mm
PCB thickness0.3-6.5mm

SMT Cases

ItemDetails

Item:High-precision SMT 

Field of application::Optical signal transmission

Density of pads:High

SMT:0402(Smallest size)

Chip density:High

BGA quantity:2PCS

BGA density:0.8mm(Smallest density)

Board thickness:2.5mm

Material types:122 kinds




Item:High-precision SMT 

Field of application::Optical signal transmission

Density of pads:High

SMT:0402(Smallest size)

Chip density:High

BGA quantity:2PCS

BGA density:0.8mm(Smallest density)

Board thickness:2.5mm

Material types:122 sorts




Item:High-precision SMT 

Field of application::HD video processing Board

Density of pads:medium

SMT:0402(Smallest size)

Chip density:High

BGA quantity:4PCS

BGA density:0.5mm(Smallest density)

Board thickness:2.0mm

Material types:76 sorts




Item:High-density DSP signal core board mounting

Field of application::High-speed DSP signal processing core board

Density of pads:High

SMT:0402(Smallest size)

Chip density:High

BGA quantity:5PCS

BGA density:0.6mm(Smallest density)

Board thickness:2.0mm

Material types:96 sorts