PCB Capability

PCB Capability

Sprintpcb Technology US, INC
sortserial numberitemsProject parameters
Ordinary abilityUltimate ability
layers/ board thickness
12-30 layers 2-26Layers30Layers
2board thickness0.3--4.0mm(Maximum thickness of bare board 5.0mm)0.2-0.3mm;4.0-5.0mm
materials1Rogers ,Arlon ,TACONIC ,Halogen-free typeother materials( need assement)
Size1maximum size(FR4)20×24 inch22×42inch(Need assessment)
Surface treatment1Surface treatmentHASL,ENIG,Gold plated .Immersion Ag, immersion Tin,OSP hard gold, carbon oil; ENIG + HASL;
2long-short golder finger ENIG ,Gold plated
impendence1impendence boardFR-4,Rogers,Arlon、Taconic
2Impedance tolerance±10%±5%(Need assessment)
others
Process capability
1Minimum BGA pad diameter10mil(No via pad,immersion AU、OSP、immersion Ag、immersion tin 8mil)8mil(No via pad,mmersion AU、OSP、immersion Ag、immersion tin 6mil)
2Thickness tolerances(≤1.0mm)±0.1/
3inner layer finished cu thickness(OZ)3 OZ4-5 OZ(need assement)
4out layer finished cu thickness(OZ)6 OZ8 OZ(need assement)
5aperture ratio 12:1(minimum hole size 0.20mm)12:1(minimum hole size 0.25mm)
6HDI TechnologyNon cross blind burial hole,three times laminationNon cross blind burial hole,6 times lamination