|Product type||backplane board|
|Field of application||photovoltaic|
|Minimum hole dia.||0.3mm|
|Technical feature||big size , CounterBore, HDI,high ratio of board thickness& hole diameter|
Design AbilityPay attention to product design, focus on providing customers the best solution for product performance, cost and manufacturing cycle.
|The minimum line width:||2.5mil||Minimum spacing:||2.5mil|
|Minimum via:||6mil (4mil laser hole)||The highest floor:||48 layers|
|Minimum BGA pitch:||0.35mm||Maximum BGA-PIN number:||3600PIN|
|The fastest signal:||40GBPS||The fastest delivery:||6 hours|
|HDI Top level:||22 layers||HDI highest level:||14th level HDI|
|PIN||Lead time(day)||Expedited lead time(day)|
Design with strict QA control;
Senior engineer "1 to 1" service;
Send daily process version to the customer to view the status of the project.
|AOI Machine||Chemistry Lab||CU Plating Process|
|Drilling Process||Etching Process||E-test Dept|
|Film Removing Line||Packing||PE Office|
|Process QC||QA||QC checking on the process|
Sprint is a one-stop PCB & PCBA solutions provider, offers design, manufacture, assembly, components sourcing, stencils and PCBA testing services.