|Product type||Double layer board|
|Field of application||multimedia equipment|
|Minimum hole dia.||0.25mm|
|Technical feature||bond line|
Design AbilityPay attention to product design, focus on providing customers the best solution for product performance, cost and manufacturing cycle.
|The minimum line width:||2.5mil||Minimum spacing:||2.5mil|
|Minimum via:||6mil (4mil laser hole)||The highest floor:||48 layers|
|Minimum BGA pitch:||0.35mm||Maximum BGA-PIN number:||3600PIN|
|The fastest signal:||40GBPS||The fastest delivery:||6 hours|
|HDI Top level:||22 layers||HDI highest level:||14th level HDI|
PIN Lead time(day) Expedited lead time(day) 0-1000PIN 3 1 1000-3000PIN 5 3 3000-5000PIN 7 5 5000-8000PIN 10 7 8000-10000PIN 13 10 10000-12000PIN 17 14
Design with strict QA control;
Senior engineer "1 to 1" service;
Send daily process version to the customer to view the status of the project.
|AOI Machine||Chemistry Lab||CU Plating Process|
|Drilling Process||Etching Process||E-test Dept|
|Film Removing Line||Packing||PE Office|
|Process QC||QA||QC checking on the process|
Sprint is a one-stop PCB & PCBA solutions provider, offers design, manufacture, assembly, components sourcing, stencils and PCBA testing services.