multi-layer boards—4L
| Type | Value |
|---|---|
| Supply Ability | 300-500 kinds of samples |
| Payment | T/T |
| Delivery | DHL,FEDEX, TNT |
| Certification | UL. IATF16949：2016 ISO9001:2015 GJB 9001B-2009 |
As a professional PCB manufacturer, we can provide you with the correct circuit board for your requirement.
Product Description
Technical Capability:
| Product type | multi-layer boards |
| Material | FR4 |
| Field of application | Data Acquisition |
| Layers/thickness | 4L/1.6mm |
| Line Space/width | 5/5 mil |
| Surface treatment | inmersion tin |
| Minimum hole dia. | 0.25mm |
| Technical feature | impedance control |
Design Ability
Pay attention to product design, focus on providing customers the best solution for product performance, cost and manufacturing cycle.| The minimum line width: | 2.5mil | Minimum spacing: | 2.5mil |
| Minimum via: | 6mil (4mil laser hole) | The highest floor: | 48 layers |
| Minimum BGA pitch: | 0.35mm | Maximum BGA-PIN number: | 3600PIN |
| The fastest signal: | 40GBPS | The fastest delivery: | 6 hours |
| HDI Top level: | 22 layers | HDI highest level: | 14th level HDI |
Delivery Ability
| PIN | Lead time(day) | Expedited lead time(day) |
| 0-1000PIN | 3 | 1 |
| 1000-3000PIN | 5 | 3 |
| 3000-5000PIN | 7 | 5 |
| 5000-8000PIN | 10 | 7 |
| 8000-10000PIN | 13 | 10 |
| 10000-12000PIN | 17 | 14 |
Design Process
Design with strict QA control;
Senior engineer "1 to 1" service;
Send daily process version to the customer to view the status of the project.
Advanced Machine
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| AOI Machine | Chemistry Lab | CU Plating Process |
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| Drilling Process | Etching Process | E-test Dept |
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| Film Removing Line | Packing | PE Office |
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| Process QC | QA | QC checking on the process |
