PCB Fab

PCB Fab


Part 1:  Comprehensive ability
sort serial number items Project parameters
Ordinary ability Ultimate ability
Inspection standards 1 Acceptance Criteria GB/T 16261-1996,
IPC-6012 Class
IPC-6012 Class
2 Acceptance Criteria military standard GJB362-96,
IPC-6012 Class

3 experiment method IPC-TM-650,GB/T4677-2002
PE software 1 design software TANGO,PROTEL,PADS2000,
Powerpcb,AUTOCAD

2 Painting technique Painting Data(GERBER Data.)and drilling Data
3 drilling Data EXCELLON(hole drawing)
layers/ board thickness
1 layers 2-26Layers 30Layers
2 board thickness 0.3--4.0mm(Maximum thickness of bare board 5.0mm) 0.2-0.3mm;
4.0-5.0mm
3 2L 0.4 -4.0mm 0.3mm-5.0 MM
4 4L 0.6mm-4.0mm 0.45mm-5.0 mm
5 6L 0.8mm—4.0 0.65mm-5.0 mm
6 8L 1.2mm---4.0 1mm-5.0 mm
7 10L 1.5mm---4.0 1.2mm-5.0 mm
8 12L 1.6m---4.0 1.4mm-5.0 mm
9 14L 1.8mm----4.0 1.65mm-5.0 mm
materials/PP
1 Common CCL Spec. 0.13 1/1, 0.13 H/H,0.21 1/1,0.25 1/1 ,0.36 1/1,0.51 1/1,0.71 1/1,1.0 1/1,1.2 1/1,1.6 H/H,1.6 1/1,1.6 2/2,2.0 1/1,2.0 2/2,2.5 1/1,3.0 1/1,3.2 1/1 0.05 H/H
,18/35 35/70 70/105
2 Common PP SPEC. 7628(0.185mm),2116(0.105mm),
1080(0.075mm), 3313(0.095mm),
RO4403(4mil),RO4350(4mil)
SPEED BRORD C;6700; 49N
3 Rogers materials Ro4350,Ro4350B,Ro4003,Ro4003C other materials( need assement)
4 Arlon materials AD350,AR1000,25FR,33N,Diclad527

TACONIC materials RF35
5 Halogen-free type(normal Tg) SY S1155,PP S0155
6 Halogen-free type(normal Tg) SY S1165,PP S0615
7 Hi- TG materials SY S1141 170,PP S0401;
SY S1170,PP S070
Size 1 maximum size 20×24 inch 22×42inch(Need assessment)
2 minimum size 2cm*3cm
3 Hi-frequency PCB maximum size 16×18 inch
Surface treatment 1 Surface treatment hasl(lead free)
Hasl(with lead)
ENIG
gold plated .Immersion Ag, immersion Tin
OSP hard gold, carbon oil; ENIG + HASL;

2 long-short golder finger surface treatment ENIG
gold plated

impendence 1 impendence board FR-4,Rogers,Arlon、Taconic
2 inpendence model Differential and single impedance
3 Impedance tolerance ±10% ±5%(Need assessment)
others
Process capability
1 Minimum BGA pad diameter 10mil(No via pad,immersion AU、OSP、immersion Ag、immersion tin 8mil) 8mil(No via pad,mmersion AU、OSP、immersion Ag、immersion tin6mil)
2 Thickness tolerances(≤1.0mm) ±0.1 /
3 Thickness tolerances(>1.0mm) ±10%(1.0mm<thickness≤2.4mm);
±8%(thickness>2.4mm)
±0.10(Thickness≤2.0);±0.15(Thickness2.0-3.0);±0.2(Thickness≥3.0)(No specified stacking requirements)
4 inner layer finished cu thickness(OZ) 3 OZ 4-5 OZ(need assement)
5 out layer finished cu thickness(OZ) 4 OZ 6 OZ(need assement)
6 aperture ratio 8:1(minimum hole size 0.20mm) 12:1(minimum hole size 0.25mm)
7 Warpage 0.7% (common);0.5%(including SMT) minimum 0.2%
8 外形 CNC、V-CUT、Bridge + stamp hole /
9 HDI Technology Non cross blind burial hole,three times lamination Non cross blind burial hole,6 times lamination
10 Thickness of insulating layer (minimum) 0.075mm(H 0Z cu) 0.06MM
11 thickness of hole wall 20—25um 25-45
12 inner layer treatment Black Oxide /
Part 2  Process production capacity
Process NO. items Project parameters

normal technology Ultimate ability
Photoplotter Data room 1 the max film size of Photoplotter 22×28 inch 36×48 inch(Outside the processing)
2 Red film exposure 28×35 inch /
3 Red film maximum size of the Developer Unilateral not more than 19.7 inch /
6 Minimum line width / spacing of Photoplotter 4/4mil 3/3mil
8 Minimum line width / spacing of Red film 4/4mil 3/3mil
Optical imaging preprocessor 1 board thickness 0.36--5mm(Chemical cleaning process:0.05--5) 0.05-5.0MM
2 Minimum size 5×6 inch /
3 maximum size Short side maximum size no more then 24 inch /
Film Laminate 1 board thickness 0.05—3.0mm 0.05-5.0MM
2 maximum size Short side maximum size no more then 24 inch /
minum space/gap 2 inner layer circuit minum width
(1/2OZ基铜补偿前)
4 mil
3 mil
3 inner layer circuit minum width
(1OZ base copper before compensation)
5mil 4mil
4 inner layer circuit minum width
(2OZ base copper before compensation)
8 mil 6 mil
5 inner layer circuit minum width
(3OZ base copper before compensation)
12 mil 10 mil
6 inner layer circuit minum width
(4OZ base copper before compensation)
18 mil 14mil
7 inner layer circuit minum width
(1/2OZ base copper after compensation)
3.5 mil
3 mil
8 inner layer circuit minum width
(1OZbase copper after compensation)
4 mil 3.5mil
9 inner layer circuit minum width
(2OZbase copper after compensation)
6mil 5mil
10 inner layer circuit minum width
(3OZbase copper after compensation)
7 mil
6 mil
11 inner layer circuit minum width
(4OZbase copper after compensation)
8 mil 7 mil
12 outer layer circuit minum width
(1/2OZ base copper before compensation)
4 mil 3 mil
13 outer layer circuit minum width
(1OZ base copper before compensation)
5 mil 4mil
14 outer layer circuit minum width
(2OZ base copper before compensation)
9mil
8mil
15 out layer circuit minum width
(3OZ base copper before compensation)
12mil 10mil
16 out layer circuit minum width
(4OZ base copper before compensation)
18mil 15mil
17 out layer circuit minum width
(1/2OZ base copper aftercompensation)
3.5 mil 3.2 mil
18 out layer circuit minum width
(1OZ base copper before compensation)
3.5 mil 3.2 mil
19 out layer circuit minum width
(2OZ base copper before compensation)
5 mil
4 mil
20 out layer circuit minum width
(3OZ base copper before compensation)
8 mil 6 mil
21 out layer circuit minum width
(4OZ base copper before compensation)
12 mil
8 mil
22 the largest production size of Exposure machine (inner layer)ASA 22×28 inch /
23 the largest production size of Exposure machine (outer layer)ORC 22×28 inch /
25 The inner isolation ring width
(single side)minum
10mil(≤6layer);12mil(7--14layer);over 14layer≥14 mil 8mil(≤6layer);
10mil(7--14layer)
over 14layer≥12 mil
26 minum Inner pad unilateral 5mil(18、35um),6mil(70um),
8mil(105um)
4mil(18、35um),
5mil(70um),
7mil(105um)
27 The inner isolation ring width(after compensation) 8 mil
7 mil
28 The minum gap :inner edge of the plate is not exposed copper 8 mil
7 mil
29 Outer conductive pattern to outline the minimum distance 8 mil 6mil

4 minum Grid line width /spacing(patten plating products) 6/6mil(1/2OZ base cu);6/6mil(1OZ base cu);
10/8mil(2OZ base cu);10/10mil(3OZ base cu);
12/12mil(4OZ base cu)。
5/5mil(1/2OZ base cu)

5 unilateral minimum width OF PTH VIAS pad
4mil 3mil

3 the minimum line width of Etch marks 8mil(18um);
10mil(35um);
12mil(70um)
6mil(18um);
8mil(35um);
10mil(70um)
AOI 1 The largest processing size(SK-75) 23.5×26 inch /
2 The largest processing size(868) 23.5×26 inch /
3 board thickness 0.05--5.0 mm /
profuctiom size 1 board thickness 0.05-2.40 mm 0.05-4.5 mm
2 The largest processing size Long side the largest size is 24Inch /
3 The smallest processing size 6×6 inch /
Lamination 1 HDI board up to the number of Lamination
3 6次
2 thickness of copper fiol
18um,35um,70um
5 Material hybrid
Rogers/ Arlon&FR-4 ROGERS+Buried capacitor(Other models need to be reviewed)
6 board thickness 0.4—3.5mm largest 5.0mm
8
The minimum thickness of the PP between layers
0.075mm(18um base copper) 0.06MM
9
Laminated pp film selection
1、Interlayer pp film stack thickness of the inner layer is the copper thickness + 0.07MM
2、For laminations using bare panels, laminates near bare panels do not allow for single lamination.

10 The largest processing size(Vacuum press machine)
22×26inch /
11 Minimum alignment between layers
4 mil 3 mil
Hole 1 Drill diameter
0.2mm-6.3mm
(interval 0.05mm,)
0.15
2 the minum hole size of HI-frequency board 0.25mm 0.20mm
3 first drill NPTH hole 0.5mm 0.2
4 Maximum aperture ratio 10:1 12:1
5 The largest processing size two drill head:20×24 inch
six drill head:20×24 inch
20×48 inch
6 Hole to conductor minimum distance 8mil(≤6L);
10mil(≤14L)
5mil(≤6L);
8mil(≤14L)
7 Hole to conductor minimum distance(HDI) 9mil(Once pressing);
10mil(Pressing twice or three times)
7mil(Once pressing);
9mil(Pressing twice or three times)
8 The hole wall minimum spacing between the same network (After compensation) 6mil 5mil
9 The hole wall minimum spacing between the different network (After compensation) 12 mil 8 mil
10 distance between the NPTH hole wall 8 mil 6 mil
11 Hole position accuracy(Compared with CAD data ±3 mil ±2 mil
12 Plug-in aperture tolerance
(PTH Hole)
±6MIL ±4mil
14 hole drilling tolerance 0.04mm 0.025mm
15 Slot aperture tolerances(drill slot) ±0.15mm(long side)
±0.10mm(short side)
±0.10mm(long side)
±0.075mm(short side)
16 Slot cutter diameter 0.60--1.20mm 0.45mm
17 Slots aspect ratio (after compensation) 1.8:1 /
18 Countersink depth tolerance ±0.2mm ±0.10mm
19 Countersink diameter tolerance ±0.15mm ±0.10mm
20 Countersink angle 82°、90° Other angle to be judged
21 Countersink angle tolerance ±10° /
Deburring machine 1 The smallest processing size 8×8inch /
2 The largest processing size Short side is less than 24 inch /
3 board thickness 0.8--5.0mm 0.25--5.0
immersion copper 1 Aperture ratio (maximum)
10:1(minum hole size0.20mm) 12:1(minum hole size0.2mm)
2 minum hole size(drill) 0.20 mm 0.15mm
3 The largest processing size 24×33 inch /
patten plating 1 Outer layer copper thickness
(1/3OZ base copper))
25—45 um /
2 Outer layer copper thickness
(1/2OZ base copper))
33—55 um /
3 Outer layer copper thickness
(1OZ base copper))
46--70 um /
4 Outer layer copper thickness
(2OZ base copper))
76--105 um /
5 Outer layer copper thickness
(3OZ base copper))
107--140 um /
6 Outer layer copper thickness
(4OZ base copper)
137--180 um /
7 Board thickness 0.2--4.8mm 20.2-5.0

8 the largest hole diameter of dry film sealing 3.6mm(one side of the PAD :8mil) 4.5mm
9 Minimum grid line space/ gaps (pattern plated, finished products) 6/6mil(18um base cu);
6/6mil(35umbase cu);8/10(70umbase cu)
5/5mil(18umbase cu)
10 The largest processing size 24×76inch /
11 The minimum distance after compensation 3.5mil 3mil
12 Aperture ratio (maximum) 10:1(Minimum drilling aperture0.20) 12:1(smallest hole size 0.2mm)
solder mask 1 The largest processing size 26Inch 40INCH
3 hardness of Solder mask 6H /
4 Solder mask unilateral minimum open size(before compensation) 2.5mil 2MIL
5 the minimum width of solder mask cover circuit one side of line 2.5(parts allowed 2mil) 2
6 The smallest open width of Solder mask 8mil 6mil
7 Solder mask unilateral minimum open size of NPTH hole 4mil 3.5mil
8 the smallest size of Blocking point bigger than the hole diameter 6mil 4mil
9 minimum width of Solder bridge 4mil(green),5mil(other color) 3.5mil(green),4mil(others)
10 SM color Green, yellow, black, blue, white, red Others need to be reviewed
11 Halogen-free SM model green(NANYA LP-4G/G-91) /
12 Solder Mask Thickness (Line Corner Min) 10UM 15UM
13 SM thickness of vias 8-10um 15UM
14 Maximum thickness of solder mask (finished product) 1OZ—3OZ 6OZ
15 board thickness the Developers processing could produce 0.4--5.0mm 0.2MM
16 the smallest size the Developers processing could produce 7×7inch 5×5inch
17 maximum produce size of the Develop machine short side maximum size 20inch short side maximum size 24inch;
18 Plug hole diameter (finished hole diameter) ≤0.35mm 0.4-0.8mm
silk screen 1 maximum production size onec printing the maximum length is 30Inch, 40INCH
2
silk screen color
white ,yellow, black gray
3 maximum copper thickness 5OZ(Characters can not cross the substrate and the copper surface)
6OZ(Characters can not cross the substrate and the copper surface)
4 Minimum width and height of character (18um base copper) width:4mil;height:27mil width:4mil;height:25mil
5 Minimum width and height of character (35um base copper) width:5mil;height:30mil width:5mil;height:28mil
6 inimum width and height of character (70umbase copper) width:6mil;height:45mil width:6mil;height:42mil
7 minimum spacing between the Character and pad 6mil 4MIL
8 minimum spacing between the Carbon oil 15mil 12mil
9 minimum spacing between the Carbon and otherconductor 10mil 8mil
10 Carbon unilateral cover line (minimum) 6mil 4mil
13 Carbon resistance 15 ohm Others need to be reviewed
14 pealable mask (model) peelable mask(SD-2955)
peelable mask with PB(SD-2954)
/
15 thickness of peelable mask 0.20--0.50mm /
16 minum size of pealable mask unilateral cover lines 7mil 6MIL
17 the minum distance between the pealable mask and PADS 16 mil 14 mil
18 the largest hole pluging diameter using pealable mask white mesh 2mm 3mm
19 The largest hole pluging diameter using pealable mask aluminum mesh 5mm 6mm
golder finger 1 NI thickness 3-5um
/
2 AU thickness 0.8-1.3um /
3 ax length of finger 2inch /
4 minum gap between the finger(finished products)
7mil 5 mil
immersion AU 1 NI thickness 3—8um /
2 AU thickness 0.05--0.75um 0.05—1.0UM
3 other surface treatment together with ENIG Carbon oil, HASL, OSP, gold finger (lead) /
immersion tin 1 tin thickness 0.80-1.20um /
2 Other surface treatment together with immersion tin Carbon oil, gold finger (lead) /
immersion Ag 1 Ag thickness 0.10-0.30um /
2 Other surface treatment together with immersion Ag Carbon oil, gold finger (lead)) /
OSP 1 film thickness 0.15-0.30um
/
2 Other surface treatment together with OSP Carbon oil, gold finger (lead)) /
HASL 1 Minimum SMT / BGA pad pitch 6mil
/
2 the largest processing size Short side 24inch /
3 the smallest processing size 7×7inch /
4 board thickness (finished products) 0.6—3.0mm 0.5-4.0mm
6 the largest processing size 22×25inch 22×42Inch(twice process)
7 the smallest processing size 6×8inch /
8 tin thickness 2-40um /
10 Other surface treatment together with HASL Carbon oil, gold finger (lead) gold finger (non-lead)
11 the smallest gap of the pattern 8mil 7mil
12 Minimum Ring Width of Metalized board edge and Metallized slot wall 30mil 20mil
HASL-Lead free 1 Minimum SMT / BGA pad pitch 7mil 6mil
2 tin thickness 2-40um /
3 Other surface treatment together with HASL-Lead free Carbon oil, gold finger (lead) gold finger (non-lead)
4 Minimum Ring Width of Metalized board edge and Metallized slot wall 30mil 25mil
outline 1 Outline processing size 21×24inch
21×40inch
3 outline dimension accuracy (edge to edge) ±6mil ±4mil
4 Min milling cutter diameter
0.8mm /
5 the smallest radius of Inner angle 0.5mm 0.4mm
6 milling cutter diameter 0.80mm、1.0mm、1.20mm、
1.60mm、2.00mm、2.40mm
/
7 Gold finger chamfer angle 20---60° /
8 tolerance of Gold finger chamfer angle ±5° /
9 depth tolerance of Gold finger chamfer ±0.20 /
10 Slot aperture tolerances(slot) ±0.15mm ±0.12mm
11 counter hole, slot depth tolerance ±0.15mm ±0.10mm
13 diameter tolerence of the second drilling ≥Limit 3mil(as:±2mil、+3/0mil ec.) ≥Limit 2mil
14 Hole position accuracy of the second drilling(Contrast with CAD data) ±5mil ±3mil
15 board thickness 0.3-2.5mm /
16 The largest processing size 20×24inch /
17 he smallest processing size 6×6inch /
18 V-CUT Angle specifications 20、30、45、60° /
19 V-CUT Angle tolerence ±5° /
20 V-CUT Symmetry tolerance ±0.05mm /
21 V-CUT Remaining thick tolerances ±0.1mm /
22 V-CUT copper Not exposed Centerline to graphic minimum distance
,Line to graphic minimum distance
(board thickness ≤1.0mm)
0.3(20°),0.33(30°),
0.37(45°),0.42(60°)
/
23 V-CUT copper Not exposed Centerline to graphic minimum distance
,Line to graphic minimum distance

(board thickness 1.0-1.6mm)
0.36(20°),0.4(30°),
0.5(45°),0.6(60°)
/
24 V-CUT copper Not exposed Centerline to graphic minimum distance
,Line to graphic minimum distance

(board thickness 1.6--2.4mm)
0.42(20°),0.51(30°),
0.64(45°),0.8(60°)
/
25 V-CUT copper Not exposed Centerline to graphic minimum distance
,Line to graphic minimum distance

(board thickness 2.5--3.2mm)
0.47(20°),0.59(30°),
0.77(45°),0.97(60°)
/
26 Gold finger chamfer angle tolerance ±5° /
27 Gold finger chamfer remaining thickness tolerance ±5 mil /
28 Gold finger lead width 20 mil 10MIL
29 the SM minimum distance between the gold finger and tin mask 1mm 0.8mm
30 the minimum distance of the TAB beside the gold finger 7mm 1MM
32 Design of the Bridge + Stamp Hole 3 stamp holes per bridge,width 0.3mm,4stamp holes,
diameter 0.6-1.0mmBridge spacing≤3inch
/
E-test 1
minimum distance of the Test point from the board edge
0.5mm /
2 Test on-resistance 10 Ohm 7
3 Test the minimum open circuit resistance 5Ohm /
4 Test the maximum insulation resistance 100 /
5 voltage test 200 V 500
6 The maximum test current 200 MA /
inspection 1 General inspection items (outlook inspection, board thickness measurement , size, area, sampling aperture) provide "finished product inspection report" /
2 Thermal stress test provide"Thermal stress test report"; /
3 Impedance test provide "characteristic impedance test report" /
4 Voltage Withstanding test provide《Voltage Withstanding test》; /
5 Ionic Contamination Test provide《Ionic Contamination Test report》; /
6 solderability test provide 《solderability test report》; /
7 mic-section analysis provide《mic-section analysis report》; /
8 Insulation resistance test provide《Insulation resistance test》; /
9 Peel strength test provide《Peel strength test report》; /