Provides higher wiring density, optimized impedance control, RF microvia solution, solid copper plating on the surface of BGAs, and improved current carrying capacity
Thermal management solution, excellent heat distribution, enhanced thermal conductivity, copper core CTE 17ppm/C, thermal conductivity 385 WmK
Embedded resistance, aerospace, communications, microwave and medical
Fully internal laminated holes increase the freedom of circuit design, solid copper provides better reliability and better electrical performance
Embedded resistance and printed internal resistance, embedded capacitance/dielectric layer insulation, flattened converters and transformers, embedded semiconductors and thin wafers, embedded components on rigid-flex board
Embedded chip for Gold Wire Bonding, connectors with limited thickness
Technology Roadmap | |||||
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inch [mm] | Standard 2018 |
Batch 2018 |
Sample 2018-2019 |
R&D 2020 |
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Key attributes | Number of layers | Up to 16L | 18L to 32L | 32L to 40L | >40+L |
Min/max thickness | 012" [.30]/.125" [3.2] | .008" [.20]/.200" [5.08] | .006" [.15]/.250" [6.35] | TBD/≥.300" [7.62] | |
Maximum pnl size | 18x24[457x610] | 24x30 [610 x 762] | 24x42 [610 x 1067] | To be determined | |
Minimum line width and line spacing (copper thickness) | Inner layer | .004" [.10] 1 | .003" [.076] H | .002" [.05] 5um | <.002" [.05] Qoz |
Outer layer | .004" [.10] T | .003" [.076] Q | .002" [.05] 5um | <.002" [.05] Qoz | |
tolerance | ±.0005" [.013] | ±.0003" [.008] | ±.00025" [.006] | ±.0002" [.005] | |
Mechanical hole size | Drill bits | .008" [.20] | .006" [.15] | .006" [.15] | .006" [.15] |
Hole pad diameter | +.008" [.20] | +.008" [.20] | +.006" [.15] | .006" [.15] | |
Aspect ratio | 10:1 | 20:1 | 25:1 | 30:01:00 | |
Base copper weights: 1=1oz H=1/2 OZ, T=3/8 OZ, Q=1/4 OZ | |||||
Pore structure | Laser hole layer | 1+N+1 | 2+N+2 | 3+N+3 | ELIC |
Buried hole | Yes | Yes | Yes | Yes | |
Stacked holes | Stacked on Sub | Yes | Yes | Yes | |
Laser hole | Smallest hole | .004" [.10] | .004" [.01] | .003" [.76] | .002" [.05] |
Hole pad diameter | +.008" [.20] | +.006" [.15] | +.004" [.10] | +.003" [.076] | |
Aspect ratio | 0.8:1 | 1:1 | 1:1 | 1:1 | |
Conduction & non-conduction hole filling | Minimum aperture | .008" [.20] | .008" [.20] | .006" [.15] | <.006" [.15] |
Aspect ratio | 12:1 | 18:1 | 26:1 | 30:1 | |
Solder mask | Counterpoint | ±.002" [.05] | ±.0015" [.038] | ±.001" [.025] | Tangency |
Minimum window | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
The smallest green oil bridge | .003" [.08] | .002" [.05] | .0015" [.038] | Eng Eval | |
Surface treatment | ENIG, OSP | ENEPIG | Thick Gold Multiple Finishes | To be determined | |
Im Sn, Im Ag | Wire Bondable Gold | ||||
LF HASL | Multiple Finishes | ||||
Hard Gold Body | |||||
Material selection | Rogers 3000/4000 | Ultra Low Loss Dk/Df | Burying the buried element |
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Halogen Free FR4 EMC 828, EMC 888K | I-Tera® I-Speed® EMC 891K | Tachyon 100G® MetroWave | |||
Buried Capacitance | Polyimid, Megtron 6N | Megtron 7N, EMC 890K | |||
408 HR Nelco-13s | Hybrid PCBs | Thermal Management PCBs |