Type | Value |
---|---|
Supply Ability | 300-500 kinds of samples |
Payment | T/T |
Delivery | DHL,FEDEX, TNT |
Certification | UL, IATF16949:2016, ISO9001:2015, GJB 9001B-2009 |
Product Description
Technical Capability:
Product type | backplane board |
Material | FR4+S1000-2 |
Field of application | photovoltaic |
Layers/thickness | 12L/4.2mm |
Line Space/width | 5/5mil |
Surface treatment | ENIG |
Minimum hole dia. | 0.3mm |
Technical feature | big size , CounterBore, HDI,high ratio of board thickness& hole diameter |
Advanced Machine
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AOI Machine | Chemistry Lab | CU Plating Process |
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Drilling Process | Etching Process | E-test Dept |
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Film Removing Line | Packing | PE Office |
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Process QC | QA | QC checking on the process |