Type | Value |
---|---|
Supply Ability | 300-500 kinds of samples |
Payment | T/T |
Delivery | DHL,FEDEX, TNT |
Certification | UL, IATF16949:2016, ISO 9001:2015, GJB 9001B-2009 |
Product Description
Technical Capability:
Product type | multi-layer boards |
Material | IT180A+R5775N |
Field of application | Supper computer |
Layers/thickness | 20L/5.5mm |
Line Space/width | 10/10mil |
Surface treatment | ENIG |
Minimum hole dia. | 0.2mm |
Technical feature | fine line,HDI,high thickness diameter ratio ,3OZ Copper, 3 group back drill |
Advanced Machine
![]() | ![]() | ![]() |
AOI Machine | Chemistry Lab | CU Plating Process |
![]() | ![]() | ![]() |
Drilling Process | Etching Process | E-test Dept |
![]() | ![]() | ![]() |
Film Removing Line | Packing | PE Office |
![]() | ![]() | ![]() |
Process QC | QA | QC checking on the process |