Combines multiple substrates (FR-4 + PTFE/Rogers) in one board
Balances cost and performance where it matters most
Enables seamless integration of high-speed and high-frequency sections on a single board
Optimized for complex multilayer stack-ups with varied electrical and thermal requirements
Used in mixed digital-control and RF circuits
| Feature | Technical specification |
| Number of layers | 4-20 Layers |
| Materials | FR4, Rogers |
| Profile method | Punching, Routting |
| Copper weights (finished) | 18 μm – 210 μm |
| FPC thickness | 0.05 mm – 3.0 mm |
| Max. dimensions | 620 mm x 720 mm |
| Min. track and gap | 0.075 mm / 0.075 mm |
| Min. mechanical drill | 0.15 mm |
| Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
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Seamless Transition to Mass Production
What are the applications of Mixed Laminate Multilayer PCBs?
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What is a Mixed Laminate Multilayer PCB? 
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