Microvias are smaller vias, typically with a diameter less than 150 microns, used in high-density designs. They’re ideal for HDI PCBs, where space is limited and precision is critical.
A buried via is located entirely within the inner layers of a PCB, with no exposure to the outer layers. It is used to connect two or more inner layers without affecting the outer surface.
A blind via connects the outer layer of a PCB to one or more inner layers but does not go all the way through the board. It’s used when you need to save space and reduce signal interference.
Yes. Hybrid PCBs use different materials to balance cost and performance—for example, combining standard FR4 with high-frequency cores in one stack-up.
Key factors include layer stack-up, impedance control, heat dissipation, and ensuring the manufacturer can meet your specifications.
Yes, HDI PCBs usually cost more due to complex manufacturing processes, but the benefits in performance and size often justify the higher price.
If your product needs to transmit signals fast and clearly—like in 5G, radar, or wireless devices—a high-frequency PCB helps maintain signal integrity, reduce signal loss, and ensure minimal interference.
A High-Frequency PCB is specifically designed for applications operating at RF and microwave frequencies, typically ranging from 3 MHz to 100 GHz. These boards are engineered to support high-speed signal transmission while minimizing losses.
High-frequency PCBs are designed to handle RF signals, which require precise impedance control, minimal signal loss, and low interference. Unlike regular PCBs, RF PCBs are made with materials that have specific electrical and thermal properties to perform reliably at high frequencies.
High-frequency PCBs are made using specialized laminates such as PTFE (Teflon), Rogers, and other low-loss materials. These materials are selected based on their dielectric constant, loss tangent, and thermal conductivity to ensure reliable performance at high frequencies.
Yes. They need precise manufacturing, tight tolerance control, and often stricter quality checks to ensure performance meets demanding specs.
No. They’re also used in automotive radar, medical equipment, satellite systems, and any product where signal quality at high speeds is critical.
Yes. They need strict bend tests, good material control, and careful inspection to avoid cracks or layer separation during use.
Good design is key. Clear bend areas, proper materials, and choosing a supplier with flex PCB experience help avoid cracks or breaks.
Pay attention to trace width, layer adhesion, and heat management. Work with an experienced manufacturer to avoid defects like uneven plating.
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