Building A19 & C2, Fuqiao No. 3 District, Fuhai Street, Bao'an District, Shenzhen, China 
+86 0755 2306 7700Building A19 & C2, Fuqiao No. 3 District, Fuhai Street, Bao'an District, Shenzhen, China +86 0755 2306 7700
| Surface Finishes Type | Advantages | Limitations |
|---|---|---|
| ENIG (Electroless Nickel Immersion Gold) |  Excellent surface flatness, ideal for BGA and Strong oxidation resistance Long shelf life RoHS compliant |  Higher cost than basic finishes Risk of "black pad" if poorly controlled |
| ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) | Suitable for wire bonding (gold and aluminum wires) Excellent solderability and corrosion resistance No black pad issue RoHS compliant | Higher cost than ENIG Complex process requiring tighter control |
| HASL LF (Lead-Free Hot Air Solder Leveling) | Cost-effective Widely available and easy to rework RoHS compliant | Uneven surface not ideal for fine-pitch components Possible thermal stress on board |
| HASL (Tin-Lead Hot Air Solder Leveling) | Good solderability and durability Long storage life Cost-effective | Not RoHS compliant Uneven surface, unsuitable for HDI/fine-pitch |
| Immersion Tin | Flat surface, ideal for SMT and fine-pitch RoHS compliant No nickel layer – good for press-fit | Short shelf life Sensitive to handling and storage Not suitable for multiple reflows |
| Immersion Silver | Excellent solderability Good performance for high-frequency signals Flat surface, RoHS compliant | Tarnishes easily if not stored properly Sensitive to handling and environment |
| OSP (Organic Solderability Preservative) | Lowest cost option Flat surface, good for SMT RoHS compliant | Very short shelf life Not suitable for multiple reflows No protection for exposed copper areas |
| Hard Gold (Electroplated Gold over Nickel) | Extremely durable and wear-resistant Ideal for edge connectors, keypads, contact surfaces Long shelf life | Expensive Not ideal for soldering applications due to hardness |
| Property | ENIG | ENEPIG | Imm. Ag | Imm. Sn | HASL LF | HASL | OSP | Hard Gold |
|---|---|---|---|---|---|---|---|---|
| Surface Flatness |  | | | | | | | |
| Solderability | | | | | | | | |
| Shelf Life | | | | | | | | |
| Cost | $$ | $$$ | $$ | $$ | $ | $ | $ | $$$$ |
| RoHS Compliant |  | | | | |  | | |
| Reflow Durability | | | | | | | | |
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