Copper on both sides supporting SMD and through-hole components
High cost-effectiveness with flexible layout options
Typical for power modules and consumer electronics
Allows for higher circuit density than single-sided designs
Ideal balance between performance and production cost for mid-range applications
Feature | Technical specification |
Number of layers | 2 Layers |
Materials | FR-4 standard, FR-4 high performance, FR-4 halogen-free |
Copper weights (finished) | 0.5 oz – 6 oz |
PCB Thickness | 0.40 mm – 6.0 mm |
Max. dimensions | 620 mm x 720 mm |
Min. track and gap | 0.075 mm / 0.075 mm |
Min. mechanical drill | 0.15 mm |
Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
Engineering Support
Prototyping Services
Fast Turnaround
Seamless Transition to Mass Production
Customer support