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HDI PCB

HDI PCB

Used in Compact, High-Performance ElectronicsMicrovia Technology | 1+N+1 to 4+N+4 Stackups | Fine Lines & Spaces | RoHS & UL Certified

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HDI PCB

Micro-blind and buried vias for ultra-fine circuitry

Maximizes space savings and functional density

Enables better signal integrity with shorter interconnections

Supports higher layer counts in thinner, lighter board structures

Used in smartphones, tablets and wearable electronics

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Process Capabilities

FeatureTechnical specification
Number of layers4 – 24 layers standard, 40 layers advanced, 60 layers prototype
HDI Builds3+N+3, 4+N+4, any layer in R&D
PCB thickness0.40 mm – 6.0 mm
Copper weights (finished)0.5 OZ – 6 OZ
MaterialsHigh performance FR4, halogen-free FR4, Rogers
Maxmimum dimensions546 mm x 662 mm
Minimum track and gap0.075 mm / 0.075 mm
Minimum mechanical drill0.15 mm
Surface finishes availableHASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimun laser drill0.10mm standard, 0.075mm advance
Special ProcessesBlind/Buried Vias, Via-in-pad, Backdrill, Sideplating,Countersunk Holes
Why Choose SprintPCB for HDI PCBs?
SprintPCB specializes in the production of HDI PCBs with laser-drilled microvias, fine lines and spaces, and advanced stackup astructures such as 1+N+1 to 4+N+4. Our precision manufacturing processes ensure high-density interconnects, excellent signal integrity,a and superior reliability for compact, high-speed electronic applications.
From Prototype to Production – We Support You All the Way

  • Engineering Support

  • Prototyping Services

  • Fast Turnaround

  • Seamless Transition to Mass Production

PCB Manufacturing Equipment
SprintPCB operate with most advance equipment in the industry to provide efficient production and high quality products with value added to our partners

Ready to Start Your HDI PCB Project?

Request a Quote / Send Your Gerber File

FAQ about HDI PCBs

How do I select materials for HDI?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
Why should I turn to HDI PCBs?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
What is the laser drill accuracy?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
How does HDI PCBs keep my cost down?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
What is a HDI PCB?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.

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