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HDI PCB

HDI PCB

Used in Compact, High-Performance ElectronicsMicrovia Technology | 1+N+1 to 4+N+4 Stackups | Fine Lines & Spaces | RoHS & UL Certified

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HDI PCB

Micro-blind and buried vias for ultra-fine circuitry

Maximizes space savings and functional density

Enables better signal integrity with shorter interconnections

Supports higher layer counts in thinner, lighter board structures

Used in smartphones, tablets and wearable electronics

Process Capabilities

FeatureTechnical specification
Number of layers4 – 60 layers
HDI Builds3+N+3, 4+N+4, any layer in R&D
PCB thickness0.40 mm – 6.0 mm
Copper weights (finished)0.5 OZ – 6 OZ
MaterialsHigh performance FR4, halogen-free FR4, Rogers
Max. dimensions620 mm x 720 mm
Min. track and gap0.075 mm / 0.075 mm
Min. mechanical drill0.15 mm
Surface finishes availableHASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimun laser drill0.10mm standard, 0.075mm advance
Special ProcessesBlind/Buried Vias, Via-in-pad, Backdrill, Sideplating,Countersunk Holes
Why Choose SprintPCB for HDI PCBs?
SprintPCB specializes in the production of HDI PCBs with laser-drilled microvias, fine lines and spaces, and advanced stackup astructures such as 1+N+1 to 4+N+4. Our precision manufacturing processes ensure high-density interconnects, excellent signal integrity,a and superior reliability for compact, high-speed electronic applications.
From Prototype to Production – We Support You All the Way
  • Engineering Support

  • Prototyping Services

  • Fast Turnaround

  • Seamless Transition to Mass Production

PCB Manufacturing Equipment
SprintPCB operate with most advance equipment in the industry to provide efficient production and high quality products with value added to our partners

Ready to Start Your HDI PCB Project?

FAQ about HDI PCBs

How do I select materials for HDI?
Materials play a large role in terms of manufacturability and direct cost of your circuit board. Here is a tip: The goal is always to select the right material for manufacturability that, at the same time, meets your temperature, and your electrical requirements. When it comes to materials, make sure that your high-speed material is also suitable for your HDI design. They are many other factors that come into play when selecting the proper materials for your design.
Why should I turn to HDI PCBs?
At some level of circuit complexity, turning to an architecture with blind and buried vias will result in better yield and lower cost than would a through-hole design.
What is the laser drill accuracy?
It is very safe to assume it is +/- 1 mil accuracy. Usually, in a staggered microvia formation, the diameters of both operate and lower microvias are the same. The key parameter that decides whether the staggering is possible or not, without the lower microvia needing to be filled, is the dimension E, the vertical separation between the central access of the two microvias. For staggering to be viable, the value of E must be greater than the microvia diameter.
How does HDI PCBs keep my cost down?
HDI PCBs help reduce costs by decreasing size, minimizing the number of components, reducing signal interference, and automating the manufacturing process.
What is a HDI PCB?
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces ≤ 100 µm / 0.10 mm, smaller vias (<150 µm) and capture pads <400 µm / 0.40 mm, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.
Are HDI PCBs more expensive than standard PCBs?

Yes, HDI PCBs usually cost more due to complex manufacturing processes, but the benefits in performance and size often justify the higher price.

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