Combines multiple substrates (FR-4 + PTFE/Rogers) in one board
Balances cost and performance where it matters most
Enables seamless integration of high-speed and high-frequency sections on a single board
Optimized for complex multilayer stack-ups with varied electrical and thermal requirements
Used in mixed digital-control and RF circuits
Feature | Technical specification |
Number of layers | 4-20 Layers |
Materials | FR4, Rogers |
Profile method | Punching, Routting |
Copper weights (finished) | 18 μm – 210 μm |
FPC thickness | 0.05 mm – 3.0 mm |
Maxmimum dimensions | 450 mm x 610 mm |
Minimum track and gap | 0.075 mm / 0.075 mm |
Minimum mechanical drill | 0.15 mm |
Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
Engineering Support
Prototyping Services
Fast Turnaround
Seamless Transition to Mass Production
Customer support