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Mixed Laminate Multilayer PCB

Mixed Laminate Multilayer PCB

Used in High-Frequency, High-Speed, and Hybrid ApplicationsMultimaterial Stackups | Signal & ThermalOptimization | Fast Turnaround | RoHS & UL Certified

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Mixed Laminate Multilayer PCB

featureCombines multiple substrates (FR-4 + PTFE/Rogers) in one board

featureBalances cost and performance where it matters most

featureEnables seamless integration of high-speed and high-frequency sections on a single board

featureOptimized for complex multilayer stack-ups with varied electrical and thermal requirements

featureUsed in mixed digital-control and RF circuits

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Mixed Laminate Multilayer PCB

Process Capabilities

FeatureTechnical specification
Number of layers4-20 Layers
MaterialsFR4, Rogers
Profile methodPunching, Routting
Copper weights (finished)18 μm – 210 μm
FPC thickness0.05 mm – 3.0 mm
Max. dimensions620 mm x 720 mm
Min. track and gap0.075 mm / 0.075 mm
Min. mechanical drill0.15 mm
Surface finishes availableHASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Why Choose SprintPCB for Mixed Laminate Multilayer PCBs?
SprintPCB specializes in the manufacturing of mixed laminate multilayer PCBs using combinations such as FR4, Rogers, and PTFEmaterials to meet high-speed, high-frequency, and thermal performance demands. Our precise lamination control and material matching ensuresignal integrity, low loss, and long-term reliability in complex, hybrid applications.
From Prototype to Production – We Support You All the Way

  • Engineering Support

    Engineering Support

  • Prototyping Services

    Prototyping Services

  • Fast Turnaround

    Fast Turnaround

  • Seamless Transition to Mass Production

    Seamless Transition to Mass Production

PCB Manufacturing Equipment
SprintPCB operate with most advance equipment in the industry to provide efficient production and high quality products with value added to our partners

Ready to Start Your Mixed Laminate Multilayer PCB Project?

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FAQ about Mixed Laminate Multilayer PCBs

Mixed Laminate Multilayer PCB FAQWhat are the applications of Mixed Laminate Multilayer PCBs?
Mixed Laminate Multilayer PCBs are widely used in demanding applications such as telecommunications, industrial controls, medical devices, and military and aerospace systems.
Mixed Laminate Multilayer PCB FAQHow are Mixed Laminate Multilayer PCBs manufactured?
Mixed Laminate Multilayer PCBs are manufactured by laminating layers of different materials such as metal-based substrates, ceramic-based materials, and FR-4, and then drilling and plating vias to interconnect the layers.
Mixed Laminate Multilayer PCB FAQWhat are the advantages of Mixed Laminate Multilayer PCBs?
The advantages of Mixed Laminate Multilayer PCBs include improved thermal management, increased electrical performance, reduced weight and improved dimensional stability.
Mixed Laminate Multilayer PCB FAQWhat is a Mixed Laminate Multilayer PCB?
A Mixed Laminate Multilayer PCB is a type of printed circuit board that combines multiple layers of different materials in its laminate structure, providing improved electrical and mechanical performance.

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