Features extra-thick copper layers (typically >2oz) for high current-carrying capacity
Ideal for power electronics, motor controllers, and industrial equipment
Enhances thermal conductivity and improves heat dissipation
Increases mechanical strength for high-reliability applications
Supports complex high-power designs while reducing the need for additional cooling
Feature | Technical specification |
Number of layers | 2-40 Layers |
Materials | FR-4 standard, FR-4 high performance, FR-4 halogen-free |
Copper weights (finished) | 2oz – 6 oz |
PCB Thickness | 0.40 mm – 6.0 mm |
Maxmimum dimensions | 510 mm x 650 mm |
Minimum track and gap | 0.075 mm / 0.075 mm |
Minimum mechanical drill | 0.15 mm |
Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
Engineering Support
Prototyping Services
Fast Turnaround
Seamless Transition to Mass Production
Customer support