Features extra-thick copper layers (typically >2oz) for high current-carrying capacity
Ideal for power electronics, motor controllers, and industrial equipment
Enhances thermal conductivity and improves heat dissipation
Increases mechanical strength for high-reliability applications
Supports complex high-power designs while reducing the need for additional cooling
Feature | Technical specification |
Number of layers | 2-40 Layers |
Materials | FR-4 standard, FR-4 high performance, FR-4 halogen-free |
Copper weights (finished) | 2oz – 6 oz |
PCB Thickness | 0.40 mm – 6.0 mm |
Max. dimensions | 620 mm x 720 mm |
Min. track and gap | 0.075 mm / 0.075 mm |
Min. mechanical drill | 0.15 mm |
Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
Engineering Support
Prototyping Services
Fast Turnaround
Seamless Transition to Mass Production
Pay attention to trace width, layer adhesion, and heat management. Work with an experienced manufacturer to avoid defects like uneven plating.
Customer support