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Multilayer PCB

Multilayer PCB

Used in Complex and High-Reliability ApplicationsUp to 60 layers | Advanced PCB Technology | Fast Turnaround | RoHS & UL Certified

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Multilayer PCB

4-60 layers for ultra-high routing density

Excellent signal integrity and electromagnetic compatibility

Support for blind & buried vias, via-in-pad, and impedance control

Engineered and manufactured with precision at SprintPCB's advanced facility

Used in servers, networking equipment and high-end medical devices

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Process Capabilities

FeatureTechnical specification
Number of layers4 – 24 layers standard, 40 layers advanced, 60 layers prototype
PCB thickness0.40 mm – 7.0 mm
Copper weights (finished)0.5 OZ – 6 OZ
MaterialsHigh performance FR4, halogen-free FR4, low loss and low Dk materials
Max. dimensions580 mm x 650 mm
Min. track and gap0.075 mm / 0.075 mm
Min. mechanical drill0.15 mm
Surface finishes availableHASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Impedance Control±8% tolerance
Special ProcessesBlind/Buried Vias, Via-in-pad, Backdrill, Sideplating,Countersunk Holes
Why Choose SprintPCB for Multilayer PCBs?
SprintPCB specializes in the manufacturing of multilayer PCBs with up to 60 layers, supporting high-speed, high-frequency,and impedance-sensitive designs. Our state-of-the-art lamination processes and advanced testing ensure performance, reliability, and long-term stability in your applications.
From Prototype to Production – We Support You All the Way

  • Engineering Support

  • Prototyping Services

  • Fast Turnaround

  • Seamless Transition to Mass Production

PCB Manufacturing Equipment
SprintPCB operate with most advance equipment in the industry to provide efficient production and high quality products with value added to our partners

Ready to Start Your Multilayer PCB Project?

Request a Quote / Send Your Gerber File

FAQ about Multilayer PCBs

What materials are used in the construction of a multilayer PCB?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
How does a multilayer PCB differ from a single-layer PCB?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
How are multilayer PCBs manufactured?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
What are the advantages of using a multilayer PCB?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.
What is a multilayer PCB?
According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.

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