4-60 layers for ultra-high routing density
Excellent signal integrity and electromagnetic compatibility
Support for blind & buried vias, via-in-pad, and impedance control
Engineered and manufactured with precision at SprintPCB's advanced facility
Used in servers, networking equipment and high-end medical devices
Feature | Technical specification |
---|---|
Number of layers | 4 – 60 layers |
PCB thickness | 0.40 mm – 7.0 mm |
Copper weights (finished) | 0.5 OZ – 6 OZ |
Materials | High performance FR4, halogen-free FR4, low loss and low Dk materials |
Max. dimensions | 620 mm x 720 mm |
Min. track and gap | 0.075 mm / 0.075 mm |
Min. mechanical drill | 0.15 mm |
Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
Impedance Control | ±8% tolerance |
Special Processes | Blind/Buried Vias, Via-in-pad, Backdrill, Sideplating,Countersunk Holes |
Engineering Support
Prototyping Services
Fast Turnaround
Seamless Transition to Mass Production
Key factors include layer stack-up, impedance control, heat dissipation, and ensuring the manufacturer can meet your specifications.
Customer support