Low-loss dielectric materials supporting frequencies up to tens of GHz
Precision impedance control to minimize signal attenuation
Requires tight tolerance in trace geometry and dielectric consistency
Excellent signal stability across wide temperature and frequency ranges
Used in 5G base stations, radar systems and RF antennas
Feature | Technical specification |
Number of layers | 4-20 Layers |
Materials | Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled |
Copper weights (finished) | 0.5 oz – 6 oz |
PCB Thickness | 0.40 mm – 6.0 mm |
Maxmimum dimensions | 580 mm x 650 mm |
Minimum track and gap | 0.075 mm / 0.075 mm |
Minimum mechanical drill | 0.15 mm |
Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
Engineering Support
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