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From Fine-Pitch to Complex PCB Assembly

SprintPCB provides full-scope SMT and THT assembly services, including BGA, QFN, fine-pitch, and mixed-technology boards.

Our production line supports IC programming and automated inspection — enabling us to deliver reliable, high-precision PCBA for critical industries.

Component Types

0402, 0201, BGA, QFN, LGA, connectors, modules
Placement Accuracy

±25μm placement for fine-pitch and high-density components
SMT & THT Assembly

Surface mount and through-hole on a single board
IC Programming

Onboard or socketed programming before or after assembly
Inspection & Testing

AOI, X-ray (BGA), ICT, functional testing per customer request
Lead-Free & RoHS Compliant

Fully compatible with RoHS and lead-free soldering profiles

Items			Conventional process	Unconventional processes
PCB specifications for SMT	Length * Width	Maximum	L≤460mm	L＞460mm
		Maximum	W≤400mm	W＞400mm
		Minimality	L≥50mm	L＜50mm
		Minimality	W≥30mm	W＜30mm
	Thickness	Thickest	4.5mm	＞4.5mm
	Thickness	The thinnest	0.5mm	＜0.5mm
Components for SMT	Dimensions	Component thickness	≤6.5mm	6.5mm＜T≤15mm
		Maximum size	200*125mm	＞200*125mm
		Min. specs	201	1005
		Min. specs	0.6*0.3mm	0.3*0.2mm
	QFP, SOP, SOJ and other multi-pin components	Min. PIN spacing	0.4mm	0.3≤Pitch＜0.4mm
	CSP、BGA	Min. ball spacing	0.5mm	0.3≤Pitch＜0.5mm
Functional Testing	Visual Inspection, In-Circuit Testing (ICT), Flying Probe Test (FPT), Automated Optical Inspection (AOI), Automated X-ray Inspection (AXI), Burn-In Testing