This PCB is built with a hybrid stack-up (RO4350 + FR4), combining the advantages of high-frequency materials and conventional FR4. The RO4350 ensures low dielectric loss and stable dielectric constant for high-speed and high-frequency signal transmission, while FR4 improves processability, mechanical reliability, and cost-effectiveness. This makes it ideal for designs requiring both performance and cost balance.

The metallized half-hole process enables modular design and small-board assembly, commonly used for reliable connections between RF/daughter boards and mainboards in telecommunication modules. This technique helps save board space, enhances assembly flexibility, and supports high-density interconnection requirements.

The ENIG surface finish (0.05 μm) provides a flat soldering surface with excellent conductivity and oxidation resistance, ensuring reliable solder joints. For RF communication applications where signal integrity and long-term stability are critical, ENIG significantly enhances reliability.

With a standard 1.6 mm thickness, the board maintains mechanical strength and compatibility with connectors and structural components in standardized assembly.

Thanks to its hybrid construction, metallized half-hole design, and ENIG finish, this PCB is widely applied in telecommunication systems, especially RF modules, antenna circuits, microwave devices, and high-speed signal processing units.