Stage 2 is to remove the unwanted copper from the panel using etching. Once this copper has been removed, the remaining dry film is then removed leaving behind the copper circuitry that matches the de

Inspection of the circuitry against digital “images” to verify that the circuitry matches the design and that it is free from defects. Achieved through scanning of the board and then trained inspector

The inner layers have an oxide layer applied and then “stacked” together with pre-preg providing insulation between layers and copper foil is added to the top and bottom of the stack. The lamination p

We now have to drill the holes that will subsequently create electrical connections within the multilayer PCB. This is a mechanical drilling process that must be optimised so that we can achieve regis

PTH provides a very thin deposit of copper that covers the hole wall and the complete panel. A complex chemical process that must be strictly controlled to allow a reliable deposit of copper to be pla

Panel plating follows on from PTH to provide a thicker deposit of copper on top of the PTH deposit – typically 5 to 8 um. The combination is used to optimise the amount of copper that is to be plated

Similar to the inner layer process (image transfer using photosensitive dry film, exposure to UV light and etching), but with one main difference – we will remove the dry film where we want to keep th

Second electrolytic plating stage, where the additional plating is deposited in areas without dry film (circuitry). Increases the plating thickness and average of 25um / min 20um through the hole. Onc

This is normally a three step process. The first step is to remove the blue dry film. The second step is to etch away the exposed/unwanted copper whilst the tin deposit acts an etch resist protecting

Just like with inner layer AOI the imaged and etched panel is scanned to make sure that the circuitry meets design and that it is free from defects.

Soldermask ink is applied over the whole PCB surface. Using artworks and UV light we expose certain areas to the UV and those areas not exposed are removed during the chemical development process – ty

The desired characters, logos, or markings are printed onto the PCB surface using a specialized ink or legend printing process. Using artwork and precise alignment, the text is applied to designated a

Various finishes are then applied to the exposed copper areas. This is to enable protection of the surface and good solderability. The various finishes can include Electroless Nickel Immersion Gold, H

This is the process of cutting the manufacturing panels into specific sizes and shapes based upon the customer design as defined within the gerber data. There are 3 main options available when providi

Used for checking the integrity of the tracks and the through hole interconnections – checking to ensure there are no open circuits or no short circuits on the finished board. There are two test metho

Using manual visual inspection and AVI – compares PCB to gerber and has a faster checking speed that human eyes, but still requires human verification. All orders are also subjected to a full inspecti

Boards are wrapped and then boxed prior to be being shipped using the requested mode of transport.

Used in Complex and High-Reliability ApplicationsUp to 60 layers | Advanced PCB Technology | Fast Turnaround | RoHS & UL Certified

Used in Compact, High-Performance ElectronicsMicrovia Technology | 1+N+1 to 4+N+4 Stackups | Fine Lines & Spaces | RoHS & UL Certified

Optimized for High-Speed and RF PerformancePTFE & Hybrid Materials | Low Dk/Df | AdvancedProcessing | RoHS & UL Certified